3D Plus (HEICO)

Manufacturer France Verified
30 Products
31 Years Active
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About 3D Plus (HEICO)

3D PLUS (a HEICO company) is a French microelectronics company founded in October 1995 and headquartered in Buc, France, that invented 3D stacking technology for space electronics and manufactures radiation-tolerant memories, computer cores, interfaces, power converters, and camera systems in miniaturised 3D-stacked packages designed to withstand space radiation environments. With over 220,000 modules deployed in orbit and 25+ years of failure-free flight heritage, 3D PLUS is ISO and ESA certified and supplies space-qualified electronics to satellite manufacturers, space agencies, and prime contractors across telecommunications, Earth observation, navigation, and deep space exploration programmes worldwide. A USA technical centre is also maintained in Sunnyvale, California.

Products

30

Space-qualified 1.3-megapixel InGaAs SWIR camera head (3DCM880) with 1280×1024 resolution at 134 fps, global shutter, and FPGA-based processing in a 40×40×44 mm package. Ideal for imaging in constrained-light environments.

3 14

Space-qualified 12-megapixel CMOS camera head with 4096×3000 resolution, 68 frame/s, global shutter, and FPGA-based processing in a 40×40×39 mm package. Available in short and long thermal drain configurations for mono and RGB.

3 13

Space-qualified 4-megapixel CMOS camera head with FPGA-based reconfigurable architecture, global shutter, 2048×2048 resolution, and SpaceWire interface in a 35×35×23 mm package. Available in monochrome (3DCM734) and RGB (3DCM739).

3 14

Space-grade configuration memory boot manager (3DCO0849) for AMD XQR Versal FPGAs, integrating 16 Gb RT NAND Flash for multiple large bitstreams in a 32×32 mm BGA package with on-orbit reconfiguration support.

1 10

Rad-hard-by-design SRAM-based FPGA computer core family with 4.4 million system gates, 128 Mbit TMR configuration memory, and optional NAND Flash and SDRAM in a single 32×32 mm BGA package. Available in four variants.

4 11

Ultra-high-density TLC NAND Flash for space in p-SLC mode, offering 4 Tb and 8 Tb capacities via ONFI 4.2/NV-DDR3 at 600 MHz. BGA-packaged for onboard recorders and payload data storage. First engineering models expected Q3 2026.

2 16

Turn-key 4-megapixel space camera system combining CASPEX 4M camera head with space-grade optics and mechanical casing. SpaceWire interface, <400 g mass, and focal length options from 8 mm to 50 mm for LEO, GEO, and deep-space missions.

4 13

Radiation-hardened latch-up current limiter (3DPM0168) for space, monitoring 0.8–5.5V supply lines up to 2A with 10 μs switch-off on overcurrent or SEL event. SOP20 packaged with adjustable thresholds for run and standby modes.

1 11

Radiation-tolerant LVDS line drivers, receivers, and transceivers for space with 4 or 8 channels in a single miniaturized SOP package, supporting >400 Mbps on 3.3V. Proven in missions from scientific to navigation satellites.

4 9

Radiation-hardened LVT dual 16-bit transceivers and level shifters for space, providing 32 channels in a single SOP82 package with cold sparing and bus hold, SEL/SEU immune, and TID >100 krad(Si).

3 10

SEE-immune non-volatile memory ASIC based on 22 nm STT-MRAM FDSOI technology with up to 1 Gb density, 100 krad(Si) TID tolerance, and immunity to SEL/SEU/SEFI/SET up to 85 MeV.cm²/mg. Developed under EU H2020 funding.

3 14

Space-qualified radiation-hardened termination regulators for DDR2/3/4 memory buses (3DPM0237/0318/0385/0424), providing ±1A or ±2A with low noise and fast transient response. SOP24 and BGA packages for compact integration.

4 16

Encoding and decoding Reed-Solomon IP core for space data protection, operating on Galois field GL(2^4) with configurable 1 or 2 symbol correction. Designed to protect data stored in space memory applications.

1 9

Fully configurable DDR2/3/4 SDRAM memory controller IP core with SEU mitigation, SEFI protection, and AMBA-compliant user interface. Supports data widths from 8-bit to 144-bit and speeds up to 1200 MHz for DDR4.

1 9

Plug-and-play radiation-tolerant NAND Flash with embedded Flash Memory Controller (FMC) and TMR/EDAC radiation protection. Available in 24 Gb, 48 Gb, and 64 Gb, enabling seamless integration with any FPGA or processor.

3 15

Space-qualified radiation-hardened point-of-load DC/DC converters in three variants (3DPM0211, 3DPM0289, 3DPM0602) covering 4.5–13.2V input and 0.8–5V adjustable output. 16-pin or 14-pin Gull Wing SMD packages with integrated EMC filters.

3 13

Radiation-hardened protection switch (3DPM0356) for space power distribution, monitoring supply lines up to 7A at 3–12V and switching off in 20 μs on overcurrent detection. BGA48 packaged with adjustable current threshold.

2 11

3-input high-speed octal majority voter (3DRC3508ES2861) with built-in TMR for SEE mitigation in space. Operates 1.65–5.5V at up to 100 Mbps with 13 ns propagation delay and cold sparing capability.

3 12

Radiation-tolerant DDR1 SDRAM modules for space applications with densities from 2 Gb to 8 Gb at 400 MT/s. Available in SOP and BGA packages; note these are not recommended for new designs.

4 12

Radiation-tolerant DDR2 SDRAM for space with densities from 1 Gb to 8 Gb at up to 667 MT/s on 1.8V. Features embedded decoupling capacitors and has flight heritage on the Mars 2020 Perseverance Rover.

5 12

Space-qualified DDR3 SDRAM with densities from 16 Gb to 24 Gb at up to 1333 MT/s on 1.35–1.5V. BGA-packaged with embedded decoupling capacitors for signal integrity in harsh orbital environments.

3 12

Radiation-tolerant DDR4 SDRAM for space with densities from 16 Gb to 64 Gb at up to 2400 MT/s on 1.2V. BGA-packaged with embedded decoupling and termination resistors for high-speed signal integrity.

5 12

Radiation-tolerant EEPROM for space with on-board and in-orbit programming capability, densities from 1 Mb to 8 Mb, 10,000 write/erase cycles, and 10-year data retention. Available in 3.3V or 5.0V versions.

2 13

Radiation-tolerant MRAM for space based on Everspin technology, offering SRAM-speed performance with inherent SEU immunity, unlimited endurance, and 20-year data retention. Densities from 1 Mb to 64 Mb.

3 13

Radiation-tolerant SLC NAND Flash for space with densities from 8 Gb to 128 Gb, 100,000 P/E cycles, and asynchronous/synchronous parallel interfaces. Designed for high-density data storage in critical 15–18 year space missions.

4 12

High-density radiation-tolerant NOR Flash memory for space on 3.3V with parallel interface, densities from 64 Mb to 2 Gb, zero bad blocks, and 20-year data retention. Flight-proven since 2008 on multiple NASA missions.

2 12

One-time programmable non-volatile PROM for space applications with up to 128 Mb density, 20-year data retention, and immunity to SEL and SEU up to 120 MeV.cm²/mg. Available with serial or 8-bit parallel interface.

3 11

High-performance radiation-tolerant SDRAM for space applications, offering capacities from 512 Mb to 4 Gb at up to 133 MT/s. Proven flight heritage since 2003 across scientific, Earth observation, and navigation missions.

4 12

Radiation-tolerant SPI NOR Flash for space in QSPI (high speed, up to 133 MHz) and TMR (SEU-immune) variants, with densities from 128 Mb to 512 Mb on 3.3V. Flight heritage since 2018 on NASA EMIT and SEACOM missions.

4 12

Radiation-tolerant SRAM memory modules for space applications, operating at 3.3V or 5.0V with densities from 4 Mb to 32 Mb and access times of 12 ns. Available in multiple bus widths and SOP packages for harsh space environments.

4 10

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