COMBO – Space-Grade Configuration Memory Boot Manager
3D Plus (HEICO)
Space-grade configuration memory boot manager (3DCO0849) for AMD XQR Versal FPGAs, integrating 16 Gb RT NAND Flash for multiple large bitstreams in a 32×32 mm BGA package with on-orbit reconfiguration support.
Technical specifications
- Part Number
- 3DCO0849 / 3DMCO0849
- Compatible FPGA
- AMD XQR Versal
- NAND Flash Capacity
- 16 Gb
- Power Supply Voltages
- 1.2V, 2.5V, 3.3V
- Temperature Range
- -40°C to +105°C
- Package
- 483 balls BGA, 1.27 mm pitch
- Module Dimensions
- 32 × 32 mm²
- Module Weight
- 22 g
- TID Tolerance
- >50 krad(Si)
- SEL LETth
- >62.5 MeV.cm²/mg
About
The 3D PLUS COMBO (3DCO0849) is a space-grade Configuration Memory BOot Manager module specifically designed to boot AMD XQR Versal FPGAs. The module combines all necessary hardware resources in a single package including an integrated 16 Gb radiation-tolerant NAND Flash memory for storing multiple large configuration bitstreams, enabling on-orbit reconfiguration capabilities for mission-critical aerospace applications.
Housed in a 483-ball BGA package (1.27 mm pitch, 32×32 mm²) with a module weight of 22 g, the COMBO provides a multi-supply design supporting 1.2V, 2.5V, and 3.3V rails, matching the power requirements of Versal devices. Operating temperature spans -40°C to +105°C.
Radiation performance includes TID tolerance greater than 50 krad(Si) and SEL LETth greater than 62.5 MeV.cm²/mg, ensuring reliable FPGA configuration and reconfiguration across the radiation environment encountered in LEO and GEO missions.
By offloading the configuration memory function from the main spacecraft computer, the COMBO reduces overall system component count and simplifies board design while providing a dedicated, radiation-tolerant boot path for the most powerful space FPGAs.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.
