LVDS Space Radiation Tolerant Interfaces
3D Plus (HEICO)
Radiation-tolerant LVDS line drivers, receivers, and transceivers for space with 4 or 8 channels in a single miniaturized SOP package, supporting >400 Mbps on 3.3V. Proven in missions from scientific to navigation satellites.
Technical specifications
- Switching Rate
- >400 Mbps (200 MHz)
- Power Supply
- 3.3V
- TID Tolerance
- >100 krad(Si)
- SEL LETth
- >80 MeV.cm²/mg
- SEU Immunity
- Immune
- Standards
- IEEE 1596.3 SCI, ANSI/TIA/EIA-644 LVDS
- Mission Duration
- 15–18 years proven
- Channel Options
- 4 or 8 channels per package
- Package Type
- SOP (SOP16, SOP18, SOP34, SOP48)
About
3D PLUS Radiation Tolerant LVDS Space Interfaces provide low voltage differential signal line drivers, receivers, transceivers, and repeaters with 4 or 8 LVDS channels in a single highly miniaturized SOP package. These components enable significant area and weight savings for space application PCBs while maintaining full compliance with IEEE 1596.3 SCI and ANSI/TIA/EIA-644 LVDS standards.
The product family covers seven device types: octal driver (3DLV3108VS1372), octal receiver (3DLV3208VS1373), quad driver/receiver (3DLV3304VS1374), quad driver (3DLV3104VS1617), quad receiver (3DLV3204VS1618), dual driver/receiver (3DLV3302VS1619), and octal repeater (3DLV3408VS1715). All operate on a single 3.3V supply at switching rates exceeding 400 Mbps (200 MHz).
Radiation performance includes TID tolerance greater than 100 krad(Si), SEL LETth greater than 80 MeV.cm²/mg, and inherent SEU immunity. All devices are available in SOP packages for SMT assembly and have demonstrated 15–18 year mission lifespans.
Applications include high-speed point-to-point data links in scientific instruments, deep space missions, Earth observation satellites, navigation spacecraft, and manned space vehicles. The highly integrated packaging approach reduces board space, connector count, and harness weight.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.
