Rad-Hard DDR Termination Regulator
3D Plus (HEICO)
Space-qualified radiation-hardened termination regulators for DDR2/3/4 memory buses (3DPM0237/0318/0385/0424), providing ±1A or ±2A with low noise and fast transient response. SOP24 and BGA packages for compact integration.
Technical specifications
- 3DPM0237 (DDR2) Input Voltage
- 1.6V to 2.8V
- 3DPM0237 Output Current
- ±1A
- 3DPM0237 Package
- SOP24
- 3DPM0318 (DDR2) Input Voltage
- 1.6V to 2.8V
- 3DPM0318 Output Current
- ±1A
- 3DPM0318 Package
- BGA127
- 3DPM0385 (DDR3) Input Voltage
- 1.2V to 1.65V
- 3DPM0385 Output Current
- ±2A
- 3DPM0385 Package
- BGA259
- 3DPM0424 (DDR4) Input Voltage
- 1.1V to 1.3V
- 3DPM0424 Output Current
- ±2A
- 3DPM0424 Package
- BGA259
- Temperature Range
- -40°C to +105°C
- TID (DDR2)
- >50 krad(Si)
- TID (DDR3/DDR4)
- >100 krad(Si)
- SEL/SET LETth
- >62.5 MeV.cm²/mg
About
3D PLUS Rad-Hard DDR Termination Regulators are compact, flexible power management solutions specifically designed for DDR2, DDR3, and DDR4 SDRAM termination in space environments. Four variants cover the DDR memory generation range: 3DPM0237 and 3DPM0318 for DDR2, 3DPM0385 for DDR3, and 3DPM0424 for DDR4.
All devices feature low input voltage, low-noise performance, fast transient response, and remote sensing to maintain precise termination voltage across the memory bus under dynamic load conditions. Radiation effect mitigation techniques are incorporated throughout the design. SOP24 and BGA packages (BGA127, BGA259) enable flexible integration alongside 3D PLUS DDR memory modules.
DDR2 variants (3DPM0237/3DPM0318) operate from 1.6–2.8V input delivering ±1A output with TID tolerance greater than 50 krad(Si). DDR3 (3DPM0385) and DDR4 (3DPM0424) variants operate from lower input voltages (1.2–1.65V and 1.1–1.3V respectively) delivering ±2A output with TID tolerance greater than 100 krad(Si). SEL/SET LETth exceeds 62.5 MeV.cm²/mg across all variants.
The termination regulator family integrates directly with 3D PLUS DDR memory modules and the RIMC memory controller IP to form a complete, radiation-hardened DDR memory subsystem optimized for space applications.
Documentation
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
Need the full ICD, test reports or a specific revision? Ask the supplier directly.
