CubeSat Kit for Microchip PIC24 MCUs w/USB OTG

This CubeSat Kit includes hardware solutions (structure, C&DH module with mass storage capability, RBF and Separation switches), software tools (RTOS, library, flash file system), development tools (programmer/debugger) and documentation. The electronics and software are based on the Microchip PIC24FJ256GB210 low-power 16-bit MCU (which adds USB On-The-Go capability versus the standard PIC24 kit). Customers can choose between different structure sizes, and solid-wall or skeletonized construction. It is designated Development Hardware, Prototyping Hardware, Development Software, Flight Hardware, Flight Qualified, and Space Proven.

The kit’s processor-independent components include a complete CubeSat mechanical structure/chassis (Base Plate Assembly, Chassis Wall Assembly in different lengths, Cover Plate Assembly, in either skeletonized or solid-wall versions), a CubeSat Kit Development Board (DB) for in-lab development/debugging/testing, a CubeSat Kit Motherboard Module (MBM) for use inside the structure, a Protoboard Module Kit for through-hole prototyping, a Remove-Before-Flight pin and lanyard, external +5Vdc 4A and 6-12Vdc universal switching power supplies, a USB cable, an Allen wrench, an offset wrench, a Phillips screwdriver, and miscellaneous fasteners/mounting hardware.

Processor-specific components for the PIC24FJ256GB210 MCU include a Pluggable Socketed Processor Module E (PSPM E) with the PIC24FJ256GB210, a Pluggable Processor Module E1 (PPM E1), a JFPC-PIC24 Programming Adapter, a Microchip MPLAB-ICD3 USB In-Circuit Debugger, Salvo Pro for PIC24 MCUs and dsPIC DSCs, PIC24 CubeSat Kit Software, and the HCC-Embedded PIC24 EFFS-THIN SD Card Library for the CubeSat Kit.

The kit is compatible with free Microchip software packages (MPLAB X IDE, XC16 C compiler) for particular supported releases. Every CubeSat Kit is compatible with a wide range of structural and electrical components including the GPS Receiver Module (GPSRM 1), Linear EPS Module, Breakout Board Module, I/O LED Module, Large Aperture Cover Plate Assembly, Solar Panel Clips Set, and Solar Panels. Includes a California Prop 65 warning regarding lead content.