AI-first 6U-class LEO satellite built entirely in-house, carrying a 9-band multispectral imager and 117-150 TOPS edge compute, with RadShield radiation coating for 5+ year LEO life.
MoI Satellite (Multispectral on-board Intelligence)
AI-first 6U-class LEO satellite built entirely in-house, carrying a 9-band multispectral imager and 117-150 TOPS edge compute, with RadShield radiation coating for 5+ year LEO life.
Description
The MoI (Multispectral on-board Intelligence) satellite is TakeMe2Space's flagship LEO spacecraft, designed and manufactured in-house from bus and subsystems through the AI inference module and imaging payload. It is the hardware backbone of OrbitLab, OrbitVault, and OrbitView services.
A proprietary RadShield tantalum-tape coating on the aluminium structure reduces Total Ionizing Dose by up to 10x, enabling terrestrial-grade electronics to operate for 5+ years in LEO at dramatically lower development cost. On-orbit AI processing via the AI Cube (117-150 TOPS) lets the satellite capture 9-band multispectral imagery, run inference models, and transmit processed results via encrypted S-Band — eliminating the need to downlink raw data and reducing customer processing costs 60-94% versus traditional workflows.
MOI-TD technology demonstrator was launched on PSLV C-60 on 30 December 2024 and declared a mission success on 20 January 2025 after validating all subsystems and more than 20 AI experiments on orbit. MOI-1 was lost on 12 January 2026 in a PSLV-C62 third-stage anomaly; MOI-1A is manifested for an October 2026 launch from California.
Specifications
| On-orbit compute (AI Cube) | 117-150 TOPS |
|---|---|
| RAM | 16 GB |
| Imaging system | 9-band multispectral imager |
| Payload power allocation | 120W |
| Peak solar generation | 67.2W |
| Battery capacity | 200Wh Li-ion |
| RadShield TID reduction | Up to 10x vs. unshielded components |
| Component operational life | 5+ years in LEO |
| Communications | Encrypted S-Band downlink |
| Cost reduction vs. traditional EO | 60-94% |
| MOI-TD OBC | Single-core 1GHz CPU, 512MB RAM |
| MOI-TD edge compute | GC7000 Lite GPU + Edge TPU (4 TOPS) |
| MOI-TD OS | Linux (C/C++ and Python support) |
| MOI-TD format | PC-104 |
| RadShield substrate | 2mm thick Aluminium AL 6061 |
| RadShield coating thicknesses | 4, 50, 100 microns (tantalum tape) |
| Thermal test range | -25°C to +65°C |
| Thermal-vac pressure | 0.00001 mBar |
| MOI-TD launch | 30 December 2024, PSLV C-60, Sriharikota |
| MOI-1 launch | 12 January 2026, PSLV-C62 (lost — LV failure) |
| MOI-1A launch (planned) | October 2026, California |