Space Radiation Tolerant PROM
3D Plus (HEICO)
One-time programmable non-volatile PROM for space applications with up to 128 Mb density, 20-year data retention, and immunity to SEL and SEU up to 120 MeV.cm²/mg. Available with serial or 8-bit parallel interface.
Technical specifications
- Memory Type
- Non-volatile, One-Time Programmable (OTP)
- Density Range
- 32 Mb to 128 Mb
- Interface
- Serial or 8-bit parallel
- Clock Rate
- 20 MHz
- Access Time
- 250 ns
- Data Retention
- 20 years
- Temperature Range
- -55°C to +125°C
- TID Tolerance
- >50 krad(Si)
- SEL LETth
- >120 MeV.cm²/mg
- SEU LETth
- >120 MeV.cm²/mg
- Package
- SOP 44
About
3D PLUS Space Radiation Tolerant PROM is a one-time programmable (OTP) non-volatile memory built on rugged memory cell technology with epitaxial semiconductor substrates and 3D PLUS’s proprietary stacking process. Capacities up to 128 Mb are offered in compact SOP 44 packages for surface mount assembly in harsh thermal and mechanical space environments.
Data can be accessed via serial or 8-bit parallel interfaces at up to 20 MHz clock rate with 250 ns access time. Data retention is guaranteed for 20 years, making PROM an ideal solution for boot code and configuration data storage across 15–18 year missions.
Radiation hardness is exceptional: TID tolerance exceeds 50 krad(Si), while both SEL and SEU immunity thresholds exceed 120 MeV.cm²/mg, providing inherent single event immunity without the need for external mitigation circuitry. Operating temperature spans -55°C to +125°C.
Available part numbers are 3DPO32M08VS1419 (32 Mb, 4M×8), 3DPO64M08VS2299 (64 Mb, 8M×8), and 3DPO128M08VS4667 (128 Mb, 16M×8), all in SOP 44 packages.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.
