Space Radiation Tolerant DDR3 SDRAM
3D Plus (HEICO)
Space-qualified DDR3 SDRAM with densities from 16 Gb to 24 Gb at up to 1333 MT/s on 1.35–1.5V. BGA-packaged with embedded decoupling capacitors for signal integrity in harsh orbital environments.
Technical specifications
- Supply Voltage
- 1.5V (1.35V backward compatible)
- Speed
- Up to 1333 MT/s
- Available Densities
- 16 Gb, 24 Gb
- Organization Options
- x16b, x48b, x72b
- Temperature Range
- -40°C to +105°C
- TID Tolerance
- >75 krad(Si)
- SEL LETth
- >60 MeV.cm²/mg
- SEU LETth
- 0.4 MeV.cm²/mg
- SEU σsat
- 1.05E-11 cm²/bit
- SEFI LETth
- 0.4 MeV.cm²/mg
- SEFI σsat
- 6.18E-6 cm²/device
- Package Types
- BGA 95, BGA 199, BGA 239
About
3D PLUS Space Radiation Tolerant DDR3 SDRAM delivers higher speed and lower power consumption compared to DDR2, available in densities of 16 Gb and 24 Gb with speeds up to 1333 MT/s. The 1.35V/1.5V supply voltage and x16b, x48b, x72b bus configurations support a broad range of high-performance computing applications in space.
All modules feature embedded decoupling capacitors for improved signal integrity and reduced board-level design complexity. BGA packages (BGA 95, BGA 199, BGA 239) offer compact footprints for miniaturized spacecraft designs. The operating range spans -40°C to +105°C.
Radiation hardness includes TID tolerance greater than 75 krad(Si), SEL LETth greater than 60 MeV.cm²/mg, and SEU LETth of 0.4 MeV.cm²/mg (σsat = 1.05E-11 cm²/bit). SEFI LETth is 0.4 MeV.cm²/mg with σsat = 6.18E-6 cm²/device.
Available part numbers are 3D3D16G16YB4751 (16 Gb, 1G×16), 3D3D16G72WB2723 (16 Gb, 256M×72), and 3D3D24G48YB2732 (24 Gb, 512M×48). Full datasheets are available for each model.
Documentation
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
Need the full ICD, test reports or a specific revision? Ask the supplier directly.
