HiK Plates / Heat Pipe Assemblies
ACT (Advanced Cooling Technologies)
Custom heat spreaders with embedded copper-water heat pipes offering effective thermal conductivities of 10,000–100,000 W/m·K, designed to collect and move heat from multiple component hotspots to card edges or remote heat sinks.
Technical specifications
- Operating Temperature Range
- 20–150°C
- Effective Thermal Conductivity
- 10,000–100,000 W/m·K
- Outer Diameter Range
- 1/16" (1.5 mm) to 1.5" (38 mm)
- Cross-Section Geometry
- Round, rectangular, or flattened
- Surface Coating Options
- Nickel or tin
- Freeze-Thaw Tolerance
- Yes
About
HiK (High Conductivity) Plates are custom-engineered heat spreaders with embedded heat pipe arrays that transport thermal energy from discrete component hotspots to remote heat sinks with minimal temperature gradients. By embedding heat pipes within a metallic plate, ACT creates a planar thermal conduit with effective conductivities far exceeding copper alone.
Copper/water heat pipes embedded in HiK plates operate between 20°C and 150°C with effective thermal conductivities of 10,000 to 100,000 W/m·K. Available outer diameters range from 1/16 inch (1.5 mm) to 1.5 inches (38 mm), with round, rectangular, or flattened cross-sections. HiK plates are particularly effective for conduction-cooled embedded computing cards (VME, VPX, cPCI formats) and Space VPX applications.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.
