3D Stacked Space Memory Modules

3D Plus designs and manufactures a comprehensive family of radiation-hardened and radiation-tolerant memory modules for space applications, using proprietary three-dimensional stacking technology to achieve high density, low power consumption, and small footprint in packages suitable for the most mass- and volume-constrained satellite designs.

The product range includes SRAM modules ranging from 4 Mbit to several Gbits, NOR FLASH and EEPROM non-volatile memories, and DRAM modules, all built using 3D Plus’s unique die-stacking process that combines multiple individual memory dies vertically into a single hermetically sealed package with tested, burned-in electrical performance. The 3D stacking process enables mixing of different technology nodes and even different foundry dies within a single module — allowing designers to select optimal silicon for each function rather than accepting the compromises of a single monolithic device.

All memory modules are available with radiation qualification data for total ionizing dose (TID), single event latch-up (SEL), and single event upset (SEU) immunity appropriate to LEO, MEO, or deep space radiation environments. Products are qualified to ESA/SCC 9000 (ESCC Basic Specification) standards and MIL-PRF-38535. 3D Plus memory modules are used in ESA, CNES, NASA, and commercial satellite programs including Earth observation, navigation, telecommunications, and interplanetary probes.