3D Plus

3D Plus was founded in 1995 as a pioneer in three-dimensional microelectronics packaging for extreme environments. The company specializes in high-density 3D stacked electronics modules — integrating memory, processors, interface circuits, and custom functions into packages offering performance comparable to much larger assemblies while occupying a fraction of the board space. This technology is particularly valuable in space applications where radiation tolerance, thermal performance, and mass/volume constraints are critical.

3D Plus produces a broad catalog of radiation-hardened and radiation-tolerant memories (SRAM, FLASH, EEPROM), data converters, transceivers, processor modules, and custom stacked assemblies qualified to space standards including ESA ESCC and MIL-PRF-38535. Products are used in ESA, NASA, CNES, and commercial satellite programs across Earth observation, navigation, telecommunications, and scientific exploration missions.

The company's 3D stacking process allows combining dissimilar technologies (different foundry nodes and chip types) into a single hermetically sealed module, enabling system designers to select best-of-breed components by function without sacrificing integration density. 3D Plus is a subsidiary of Heico Corporation and supplies products to satellite manufacturers and prime contractors worldwide.